ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-lvysbks2063/r1 rev. : a date : 22 - oct. - 2007 lvysbks2063/r1 lead-free parts pb bipolar type led lamps
sbks vy 3.0 4.0 1.5max 5.2 4.2 1 2 2.54typ 1.0min 1 2 25.0min 0.5 typ 1/6 page part no. package dimensions lvysbks2063/r1 ligitek electronics co.,ltd. property of ligitek only 30 60 75% 50%100% directivity radiation -30 0 -60 25% 50% 75% 0 100% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25%
page 2/6 unit ratings symbol parameter absolute maximum ratings at ta=25 ma ma 60 30 30 100 mw a 75 50 10 120 i fp i f forward current pd ir reverse current @5v power dissipation peak forward current duty 1/10@10khz vy sbks ligitek electronics co.,ltd. property of ligitek only -30 ~ +100 -20 ~ +80 tstg t opr operating temperature storage temperature luminous intensity @20ma(mcd) forward voltage @20ma(v) color typical electrical & optical characteristics (ta=25 ) typ. min. 38 220 120 min. typ. ---- 1.7 590 20 max. 2.6 47526 4.2 386538 3.5 ---- lens emitted water clear yellow lvysbks2063/r1 algainp ingan/sic blue note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. material part no viewing angle 2 1/2 (deg) dominant wave length dnm spectral halfwidth nm esd electrostatic discharge( * ) 2000 v 500 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * lvysbks2063/r1 part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page3/6 lvysbks2063/r1 part no.
25 ambient temperature( ) fig.3 forward current vs. temperature 0 f o r w a r d c u r r e n t @ 2 0 m a 0 10 20 40 30 680 630 530 430 480 480 0 380 580 r e l a t i v e i n t e n s i t y @ 2 0 m a 100 5075 wavelength (nm) fig.4 relative intensity vs. wavelength 0.5 1.0 2 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 1 0 5 10 15 30 25 20 sbk-s chip 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward current(ma) 5 4 3 05 forward voltage(v) 0 0.25 0.75 0.5 30 25 15 1020 fig.2 relative intensity vs. forward current 1.5 1.25 ligitek electronics co.,ltd. property of ligitek only page4/6 lvysbks2063/r1 part no.
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 5 /sec max 260 c3sec max temp( c) 260 100 50 2 /sec max preheat 25 0 0 60 seconds max 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) lvysbks2063/r1 part no.
page 6/6 description test condition test item reliability test: this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. operating life test low temperature storage test high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reference standard the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. lvysbks2063/r1 part no.
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